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Haptic Module Process Engineer
LOS ANGELES CA 90001
Category: Computing, Publishing
  • Your pay will be discussed at your interview

Job code: lhw-e0-79070834

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Apple

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  Job posted:   Sat Oct 21, 2017
  Distance to work:   ? miles
       
  1 Views, 0 Applications  
 
Haptic Module Process Engineer

# Haptic Module Process Engineer


Job Number: 113164574

Santa Clara Valley, California, United States

Posted: 19-Oct-2017

Weekly Hours: 40.00


**Job Summary**

Apple designs consumer products that touches millions. The Camera Hardware Engineering group is responsible for the development, test, and qualification of camera hardware for Apple products.


We are looking for an outstanding Haptics Module Packaging, Process and automation engineer to work on and support camera hardware engineering projects.


**Key Qualifications**

* 10+ years experience working with mechanical systems such as hard drives or fans

* Experience working with subcontractors to develop equipment, materials and process to manufacture small, precision mechanical systems

* Experience with high volume manufacturing ramps, and transition from development to production

* Work closely with internal cross functional teams, Product Design, Test, Electrical Engineering, Mechanical Engineering, Operations

* Ability to work with international teams and travel


**Description**

Core responsibilities:

- Work as the key module process engineer supporting complex, high volume haptic actuators, based in Cupertino

- Provide leadership in the areas of module construction, materials, equipment, processes, reliability, and testing

- Participate in the assessment and selection of vendors

- Work with vendors to develop MP intent equipment, process and materials

- Provide leadership to a team of Asia based process engineers supporting the process development and qualification

- Provide communication to senior management on issues as needed

- Travel to vendor sites will be required


**Education**

MS in ME, EE, or Physics as minimum. Ph.D. is preferred.


**Additional Requirements**



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